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Important Dates

Paper Submission Deadline: 26. February 2024
Notification of Acceptance: 16. March 2024
Final Paper Submission: 13. April 2024
Early Bird Registration: 13. April 2024

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General Information

The International Conference on Microwave Acoustics & Mechanics (IC-MAM) represents a unique and unprecedented opportunity to bring together researchers and practitioners of different background (materials scientists, physicists, microwave engineers and process technologists), to share the most recent advances in new materials and manufacturing processes as well as components and devices, which represent the key for the development of future RF, microwave, mm-wave and THz devices, circuits and systems based on RF-MEMS and Acoustics. IC-MAM is organized by the IEEE Microwave Theory and Technology Society (MTT-S). The conference features an exciting technical program and invited talks by worldwide recognized experts of RF-MEMS and BAW/SAW technologies.

Chengdu, China

Chengdu is a sub-provincial city which serves as the capital of the Chinese province of Sichuan. With a population of approx. 21 million inhabitants it is the fourth most populous city in China Chengdu is located in central Sichuan. The surrounding Chengdu Plain is known as the "Country of Heaven" and the "Land of Abundance". Its prehistoric settlers included the Sanxingdui culture. The site of Dujiangyan, an ancient irrigation system, is designated as a World Heritage Site. The Jin River flows through the city. Chengdu's culture largely reflects that of its province, Sichuan; in 2011, it was recognized by UNESCO as a city of gastronomy. It is associated with the giant panda, a Chinese national symbol, which inhabits the area of Sichuan; the city is home to the Chengdu Research Base of Giant Panda Breeding.

For more details, please read the Wikipedia article of Chengdu.

Call for Papers

The purpose of IC-MAM is to boost technical and educational activities as well as exchanges and collaborations within the international microwave community. Perspective authors are cordially invited to submit papers in all areas of new materials and manufacturing processes as well as components and devices, which represent the key for the development of future RF, microwave, mm-wave and THz devices, circuits and systems based on RF-MEMS and Acoustics.

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Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.